It is high purity silver flake having the handling and performance characteristics of flake and powder. Unique electrical and rheological properties suitable for most die attach paste formulations and dispersing techniques
General Description:
Low surface area high density, high purity silver flake.Unique rheological properties suitable for die attach paste formulations and dispensing techniques.
Typical Properties:
Physical Data:
Particle Size Distribution:
Tap Density:
4.0 - 5.5 g/cm�
D10:
2.0 um
Surface Area:
0.3 - 0.8 m�
/g
D50:
6.0 um
Loss on Drying: (1hour @ 110�C in air)
<0.1%
D90:
13.0 um
Loss on Ignition: (1 hour @ 538�C in air)
<0.5%
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Typical Applications:
Fired and non-fired thick film pastes.
Die attach adhesive
Pb free solder replacement
Conductive film
Conductive EMI Shielding coatings
