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Powder Details
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SA0180
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Fine Particle Spherical Alumina - SA0180
This spherical fine particle of alumina, in addition to high sphericity and high-precision particle-size control, are capable of exhibiting unique performance, with the advantages of heat resistance, hardness, thermal conduction and other characteristics of alumina. By adjusting particle size distribution in accordance with desires of customers, we can serve customers' needs with an extensive availability of customized products.
| Product Name | SA0125 | SA0103 | SA0109 | SA0118 | SA0180 | | Particle Diameter | um | 22 ~ 28 | 18 ~ 24 | 2.5 ~ 4.5 | 2.5 ~ 4.5 | 30 ~ 40 | | Specific Surface Area | m2/g | 0.22 | 0.16 | 0.65 | 0.60 | 0.20 | | Al2O3 | % | 99.8 | 99.9 | 99.8 | 99.8 | 99.8 | | SiO2 | ppm | 780 | 400 | 800 | 800 | 780 | | Fe2O3 | ppm | 140 | 76 | 155 | 155 | 140 | | CaO2 | ppm | 60 | 30 | 75 | 75 | 60 |
| MgO2 | ppm | 10 | 15 | 22 | 22 | 10 | | Na2O | ppm | 1100 | 560 | 620 | 620 | 1100 | | K2O | ppm | 22 | 27 | 31 | 31 | 22 | | Upper Sieve Size | um | 75 | 125 | 15 | 32 | 75 |
[Characteristics]
High purity (alpha alumina)
High sphericity (high roundness)
High flowability and high packing density
High filling density
High thermal conductivity
Low thermal expansion ratio
Good wear resistance
Electric insulation property
Low water absorption property
Sharp distribution
The fine particles of alumina - spherical in shape and offering the properties desired of alumina (high thermal conductivity, good heat resistance, high electrical insulation, high hardness, etc.) - has many different purposes in diverse fields, including various types of resins as fillers for thermal conductive sheets, fillers for molding materials, base powder for baking ceramics, blasting materials and spacers.
As a filler for thermal conductive sheets, in particular, alumina is very popular since it is comparatively inexpensive and offers high thermal conductivity. Because of the spherical nature of these powder particles, it is possible to easily enhance the packing density of the filler. In addition, by controlling the particle size distribution with a combination of two or more types of spherical alumina, it is possible to improve the thermal conductivity of the filler.
[Application]
Thermally conductive resin (for radiation)
Bedding powder for baking
Various kinds of spacer
Blasting material
At present, fillers for semiconductor encapsulation materials represent the major application of spherical fine particles. Further, the spherical fine particles have high packing density and high flowability, so they are expected to be employed for various new applications other than semiconductor materials. |
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